| Product Scope | Confirm whether the supplier provides microcontrollers, application processors, connectivity ICs, power-management ICs, memory, sensors, or complete system-in-package solutions. | Product capability should match the required architecture, operating system, interfaces, package type, and target application. | Current datasheets, reference designs, product-change notices, lifecycle statements, and interface documentation. | Medium |
| Process Technology | Review the manufacturing process used for the required performance, power consumption, analog precision, voltage range, and product lifetime. | Mature process nodes are commonly selected for industrial, automotive, and long-lifecycle embedded products because they can offer stable supply and proven qualification history. | Process-node information, wafer-fab location, qualification reports, and documented process-change controls. | High |
| Package and Assembly | Check package dimensions, thermal performance, moisture sensitivity, pin compatibility, assembly equipment, and board-level reliability. | QFN, QFP, BGA, LGA, CSP, and wafer-level packages are widely used in embedded electronics; package availability must be checked for each device. | Mechanical drawings, package qualification data, MSL rating, soldering profiles, and material declarations. | High |
| Quality Management | Assess whether the manufacturing and assembly sites operate a documented quality-management system. | ISO 9001 is a general quality-management benchmark. Automotive programs commonly require IATF 16949 and additional customer-specific quality controls. | Valid certificates, scope statements, audit summaries, corrective-action records, and inspection plans. | High |
| Automotive Qualification | For vehicle applications, verify component qualification, temperature grades, failure-rate targets, traceability, and change notification procedures. | AEC-Q100 is a widely recognized qualification framework for integrated circuits; qualification alone does not replace application-level validation. | AEC-Q100 reports, temperature-grade data, PPAP capability, reliability results, and production-part approval records. | High |
| Industrial Reliability | Match the component’s operating temperature, humidity, vibration, voltage transients, and expected service life with the end product. | Commercial, industrial, and automotive temperature grades differ; the buyer should not infer the grade from the product family name alone. | Operating-temperature range, HTOL data, temperature-cycle results, HAST or biased-humidity data, and FIT or MTBF methodology. | High |
| Compliance | Check restrictions on hazardous substances, chemical content, radio functions, export controls, and the destination market’s product rules. | RoHS and REACH documentation is commonly requested for electronics sold into European supply chains; wireless products may require additional radio approvals. | RoHS test reports, REACH declarations, material declarations, safety data where applicable, and regional conformity documents. | High |
| Firmware and SDK Support | Evaluate development tools, software libraries, security updates, documentation quality, debugging support, and long-term maintenance. | A technically suitable chip can still create project risk if the SDK, bootloader, drivers, or documentation are incomplete or maintained only in one language. | SDK release history, software license terms, issue-response policy, security-advisory process, and sample application code. | High |
| Security Features | Review secure boot, hardware cryptography, trusted execution, key storage, debug authentication, and vulnerability-response procedures. | Security requirements should be defined before design-in because hardware-rooted features are difficult to add after the PCB and firmware architecture are finalized. | Security architecture, threat model, secure-development process, vulnerability disclosure policy, and independent assessment results. | High |
| Supply Continuity | Identify wafer-fab, assembly, test, and substrate dependencies and determine whether alternate production sites exist. | A multi-site strategy can reduce single-site exposure, but qualification of an alternate site may require engineering samples and customer approval. | Business-continuity plan, site list, capacity statement, allocation policy, last-time-buy procedure, and product-lifecycle notice process. | High |
| Lead-Time Planning | Separate sample timing, engineering-run timing, normal production lead time, and allocation-period lead time. | Lead times vary with wafer capacity, package materials, test capacity, demand cycles, and order visibility; a quoted lead time is not a guaranteed delivery date. | Written lead-time assumptions, capacity reservation terms, rolling forecast requirements, and delivery-performance history. | High |
| Minimum Order Quantity | Confirm minimum order quantities for samples, pilot builds, production orders, custom marking, packaging, and firmware variants. | Standard catalog parts generally offer more flexible purchasing than custom or semi-custom devices; commercial terms must be confirmed before design approval. | Quotation, price-break schedule, MOQ policy, NCNR terms, sample policy, and inventory ownership terms. | Medium |
| Traceability | Ensure that every shipment can be traced to wafer lot, assembly lot, test date, package, and manufacturing location. | Lot-level traceability is essential for failure analysis, recalls, counterfeit prevention, and regulated applications. | Certificate of conformance, date-code policy, lot-code format, packing labels, and sample traceability records. | High |
| Counterfeit Protection | Use authorized channels and verify packaging, markings, electrical behavior, and chain of custody when buying from independent distributors. | Unusually low pricing, mixed date codes, altered markings, missing test records, or incomplete packaging are warning signs that require investigation. | Authorized-distribution confirmation, inspection reports, electrical test results, photographs, and chain-of-custody documentation. | High |
| Intellectual Property | Define ownership of mask work, firmware, custom designs, test programs, documentation, and improvements before technical work begins. | A written NDA and clear IP ownership clauses are basic controls; they should be reviewed for enforceability in the relevant jurisdictions. | NDA, development agreement, IP schedule, source-code escrow terms where appropriate, and employee or subcontractor confidentiality controls. | High |
| Factory Audit | Audit the actual wafer, assembly, and test locations rather than relying only on a trading company’s office or online profile. | A remote review can support initial screening, but an on-site or qualified third-party audit provides stronger evidence of process control and capacity. | Audit checklist, site photographs, process-flow records, calibration logs, nonconformance reports, and subcontractor list. | High |
| Validation Before Design-In | Test samples on the intended PCB and under actual voltage, temperature, load, EMC, software, and mechanical conditions. | Evaluation boards and laboratory results are useful for screening but cannot replace design validation, production validation, and field-reliability testing. | Engineering-validation plan, test limits, failure criteria, environmental test results, EMC results, and signed approval records. | High |
| Commercial Contract | Clarify delivery terms, payment milestones, warranty, nonconforming material, liability limits, inspection rights, governing law, and dispute resolution. | Incoterms define delivery responsibilities and cost allocation but do not by themselves define product quality, warranty, or IP obligations. | Master supply agreement, purchase terms, Incoterm version and named place, warranty terms, and quality agreement. | High |
| Recommended Selection Method | Use a weighted scorecard instead of selecting solely on unit price or sample availability. | A practical scorecard can assign higher weight to quality, lifecycle, supply continuity, security, and technical support than to initial purchase price. | Supplier questionnaire, documented scoring criteria, sample-test results, audit findings, and approval sign-off from engineering, quality, and procurement. | Low |
